Storage
- It is recommended that the devices are stored boxed
with a desiccant included in the packing. This applies
to both taped and loose products.
- It is advised that if the devices are not stored boxed
as above, the following conditions are met:
- Temperature range: 5 to 30°C
- Humidity: 60% RH MAXIMUM.
- It is recommended that the devices are soldered as
quickly as possible after unpacking and that any items
remaining are re-packed for storage.
- The protective finish of the leads may be affected
by atmospheric polution if not correctly stored, causing
possible problems during the soldering process.
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PCB Populating
- Care must be taken not to damage the surface of the
epoxy moulding during the population process as this
could affect the light output of the device.
- The hole centres in the PCB should match the lamp
lead centres for efficient product placement. If lead
forming is required it is recommended that any bending
takes place no closer than 2 mm from the epoxy moulding
base and that the lead is fully supported above the
bend point to ensure forces are not transmitted into
the epoxy moulding causing possible fractures or damage
to the internal wire bonding.
- If lead forming is required it should be carried out
before soldering.
- No repositioning of the lamp should be done after
soldering.
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Drying
- It is recommended that if the devices have been unpacked
and exposed to the atmosphere for a period of more than
72 hours, they are dried for 10 to 12 hours at 60°C
before use.
- If the desiccant has become fully saturated it is
recommend that the items are dried for a period of 24
hours at 80°C before use.
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Soldering
- It is recommended that the devices are soldered as
soon as possible after unpacking and that any items
remaining are re-packed in the original packaging for
storage. It is recommended that the devices are wave
soldered in line with the parameters shown on the wave
soldering graph (see below).
- Care must be taken not to cause stress to the epoxy
moulding section of the lamps whilst they are exposed
to high temperature during the soldering process.
- Mechanical forces must be avoided during the cooling
process.
- Rapid cooling after soldering should be avoided.
- Allow the product to cool to room temperature before
any following processes take place.
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Handling / Loading
- Industry standard procedures regarding static must
be observed when handling product produced with InGan
die material. Damage can occur to products subjected
to ESD or transient voltage spikes leading decreased
product reliability.
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