Storage

• It is recommended that the devices are stored boxed with a desiccant included in the packing. This applies to both taped and loose products.
  
• It is advised that if the devices are not stored boxed as above the following conditions are met:
  - Temperature range: 5 to 30°C
  - Humidity: 60% RH MAXIMUM.
  
• It is recommended that the devices are soldered as quickly as possible after unpacking and that any items remaining are re-packed for storage.

Soldering

• It is recommended that the devices are soldered as soon as possible after unpacking and that any items remaining are re-packed in the original packaging for storage.
  
• The lamps must be mounted in line with the specified solder pad pattern shown on the respective product data sheet. The solder paste must be of even thickness on all pads to ensure correct positioning and bonding of the product to the PCB.
  
• It is recommended that the devices are reflow soldered in line with the parameters shown on the reflow soldering graph (see below).
  
• It is recommended that the leads of the product are orientated perpendicular to the direction of the PCB travel during the soldering operation so that the solder for each lead melts simultaneously.
  
• Care must be taken not to cause stress to the lens section of the lamps whilst they are exposed to high temperature during the soldering process.
  
• Mechanical forces must be avoided during the cooling process.
  
• Rapid cooling after soldering should be avoided.
  
• Allow the product to cool to room temperature before any following processes take place.

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Drying

• It is recommended that if the devices have been unpacked and exposed to the atmosphere for a period of more than 72 hours, they are dried for 10 to 12 hours at 60°C before use.
  
• If the desiccant has become fully saturated it is recommend that the items are dried for a period of 24 hours at 80°C before use.

Handling / Loading

• Industry standard procedures regarding static must be observed when handling product produced with InGan die material. Damage can occur to products subjected to ESD or transient voltage spikes leading to decreased product reliability.
  
• Care must be taken not to damage the emitting surface of the epoxy during the assembly process as this could affect the light output of the device.
  
• In the case of taped products, it is recommended that the backing tape is removed at a speed of less than 10 mm/s.