Storage
- It is recommended that the devices are stored boxed
with a desiccant included in the packing. This applies
to both taped and loose products.
- It is advised that if the devices are not stored boxed
as above the following conditions are met:
- Temperature range: 5 to 30°C
- Humidity: 60% RH MAXIMUM.
- It is recommended that the devices are soldered as
quickly as possible after unpacking and that any items
remaining are re-packed for storage.
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Soldering
- It is recommended that the devices are soldered as
soon as possible after unpacking and that any items
remaining are re-packed in the original packaging for
storage.
- The lamps must be mounted in line with the specified
solder pad pattern shown on the respective product data
sheet. The solder paste must be of even thickness on
all pads to ensure correct positioning and bonding of
the product to the PCB.
- It is recommended that the devices are reflow soldered
in line with the parameters shown on the reflow soldering
graph (see below).
- It is recommended that the leads of the product are
orientated perpendicular to the direction of the PCB
travel during the soldering operation so that the solder
for each lead melts simultaneously.
- Care must be taken not to cause stress to the lens
section of the lamps whilst they are exposed to high
temperature during the soldering process.
- Mechanical forces must be avoided during the cooling
process.
- Rapid cooling after soldering should be avoided.
- Allow the product to cool to room temperature before
any following processes take place.
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